DeepX Wins CES 2026 Innovation Awards as Partner Sixfab Takes Top Honor with ‘Best of Innovation’
Global AI semiconductor company DeepX has won CES 2026 Innovation Awards in two categories with its products. Additionally, Sixfab, a U.S.-based IoT and edge computing specialist, achieved remarkable success by winning CES’s highest honor, ‘Best of Innovation,’ with its AI gateway ‘ALPON X5’ powered by DeepX‘s DX-M1 chip. This demonstrates that DeepX’s products are substantially enhancing the competitiveness of its global partner ecosystem and further solidifying its position as a global standard for physical AI.

DeepX has proven both technological innovation and market competitiveness on the global stage over the past three years. At CES 2024, the company won Innovation Awards in the robotics, embedded technology, and hardware components categories with its first-generation chipset DX-M1, becoming the first AI semiconductor company to achieve a triple crown.
The following year at CES 2025, the Consumer Technology Association (CTA) officially designated DeepX as a “Must-See Company.” More than 16,000 visitors attended DeepX’s exhibition booth, demonstrating that the company’s ultra-low-power, high-performance AI semiconductors are key solutions for intelligentizing actual industrial sites.
At CES 2026, DeepX’s innovative AI semiconductors were recognized not just for performance competition, but for demonstrating practical technological capabilities to apply AI on a large scale in actual industrial settings, winning Innovation Awards in the computing hardware and embedded technology categories.
CES 2026 is particularly evaluated as a turning point where global partner products featuring DeepX technology began to achieve substantial market success. A representative example is Sixfab’s ‘ALPON X5,’ which won CES’s highest honor ‘Best of Innovation’ with DeepX’s DX-M1 chip embedded, achieving a trajectory from the 2024 CES Innovation Award technology to a global partner’s top award in 2026.
‘ALPON X5’ is evaluated as a transitional solution toward the AI 6G era and a bridgehead for next-generation intelligent network infrastructure. As an on-device AI gateway that analyzes and processes data in real-time on-site without relying on the cloud, it enables ultra-low-latency intelligent control at terminal nodes of industrial, urban, and transportation infrastructure.
Sixfab is a U.S.-headquartered IoT and edge computing specialist that supplies AI gateways and edge modules based on single-board computers (SBC) like Raspberry Pi, earning high trust in the global developer community.
The ‘ALPON X5’ AI gateway that won the CES top award features DeepX’s ultra-low-power AI semiconductor DX-M1. This product boasts power efficiency more than 10 times better than GPUs and can perform high-precision AI inference with power consumption under 5W. While maintaining GPU-level AI accuracy, it dramatically reduces heat and costs, enabling stable AI operations even in industrial and infrastructure environments with significant power constraints.
The CES jury evaluated ALPON X5 as a “realistic yet scalable AI infrastructure model,” highly praising it as next-generation on-device AI hardware that can replace cloud-centric AI structures. This product is particularly attracting attention as a core platform enabling real-time data processing and autonomous recognition functions in smart factories, smart retail, smart cities, and mobility.
DeepX and Sixfab plan to build a joint reference platform in the global industrial AI gateway market through this collaboration. Through this, both companies will lead the popularization of energy-efficient and sustainable AI infrastructure across various industrial sectors.
DeepX will officially unveil its Innovation Award-winning products along with Sixfab’s ‘Best of Innovation’ winner ‘ALPON X5’ for the first time globally at CES 2026, held in Las Vegas, USA, from January 6-9, 2026. Additionally, the company will host the newly established ‘CES Foundry’ session by CTA, presenting industrial vision and technology roadmap toward the physical AI era with global partners.
Furthermore, through media briefings at the CES venue, DeepX will directly reveal next-generation ultra-low-power AI semiconductors and global partner ecosystem strategies, expected to be an occasion presenting new industry standards for on-device AI.
Sait Borlak, CEO of Sixfab, stated, “This CES ‘Best of Innovation’ award is a moment when Sixfab’s pursuit of ‘practical AI innovation’ has been officially recognized. DeepX’s DX-M1 chip has made the core of ultra-low-power, high-performance edge computing we’ve long dreamed of a reality,” adding, “With ALPON X5, customers worldwide will be able to build more efficient and sustainable AI infrastructure.”
Nokwon Kim, CEO of DeepX, emphasized, “This award is particularly meaningful in that DeepX’s technology is not simply staying at the semiconductor level, but is being embedded in products of customers and partners, creating ‘global innovation standards’ together,” stating, “We will strengthen leadership so that AI can be utilized in a more efficient and human-oriented direction worldwide and expand a sustainable AI ecosystem.”
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