Uniqconn Raises $12.85M Series B to Bring Cable-Free Chip Technology to Mass Market

Uniqconn, a South Korean fabless semiconductor startup on a mission to make wired interfaces obsolete, has closed a Series B round of approximately $12.85 million (18.5 billion KRW). The raise brings its total funding to roughly $23.33 million (33.6 billion KRW).

The round included BonAngels Venture Partners, Korea Development Bank, Doosan Investment, K & Investment Partners, REINVESTMENT, and L&S Venture Capital.

The core problem Uniqconn is solving is deceptively simple: why, in a world saturated with wireless technology, are the most performance-critical device interfaces still tethered by cables? Existing standards like Wi-Fi and Bluetooth can’t reliably deliver the combination of ultra-low latency and high bandwidth that interfaces such as USB, HDMI, and MIPI demand. Uniqconn’s answer is the UC60 — a 60GHz band full-duplex wireless semiconductor chip that replicates the reliability of a physical cable connection without any conductor contact.

Founded in 2022 and based at the System Semiconductor Design Support Center in Seongnam’s Pangyo Techno Valley, the company has already validated the UC60 in smartphones, laptops, and robotic arm joints, and is now preparing for mass production. 

More recently, Uniqconn has set its sights on the fast-growing physical AI space — running early-stage trials for humanoid robots, autonomous vehicles, and space data center docking systems, all of which require the kind of stable, high-speed wireless links that conventional radio technologies struggle to provide.

The startup has built credibility well beyond its Series B. It took home a CES 2026 Innovation Award for the UC60, counts Qualcomm and Rosenberger among its global PoC partners, and has been tapped as one of 25 semiconductor companies in the Korean government’s Super Gap Project 1000+, a national program funding the next wave of globally competitive deep-tech startups.

The fresh capital will go toward scaling up mass production, expanding into international markets, and deepening the company’s R&D capabilities.

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